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In this session from ATxSG, Frederic Salmon, VP Asia Pacific for BICS SA/NV outlines how 5G is a technology enabler for enterprises and how 5G will impact APAC.
In this session from ATxSG, hear from telco experts from the likes of NCS, Omdia, Google and M1 on how telco companies in Asia can become more agile and adaptive to customer needs and take advantage of new digital opportunities.
In this interview, Ben Wodecki sat down with Stephen Raj, partner, global sales for Telco+ at NCS. Stephen outlined how telcos should aim to adapt and evolve in order to keep pace with increasing innovation.
In this interview, Ben Wodecki is joined by Katsuo Ejima, chief evangelist of QKD Business Development Office at Toshiba Digital Solutions and Chune Yang Lum, co-founder and CEO at SpeQtral. The trio talk about how quantum technologies can be the essential cybersecurity tool of the future.
In this interview, Ben Wodecki is joined by Katsuo Ejima, chief evangelist of QKD Business Development Office at Toshiba Digital Solutions and Chune Yang Lum, co-founder and CEO at SpeQtral. The trio talk about how quantum technologies can be the essential cybersecurity tool of the future.
In this session, SpeQtral CEO Chune Yang Lum and Katsuro Ekima from Toshiba's QKD office outline how quantum key distribution technology can be adopted in today’s networks and what the secure communications networks of the future would look like
In this eBook, sponsored by information and communications technology (ICT) provider Huawei, we explore the new intelligent applications that digital connectivity will bring.
In this eBook, sponsored by information and communications technology (ICT) provider Huawei, we explore the current 5G landscape, and the future opportunities and challenges.
At the AI Summit New York, IBM Consulting's Manish Goyal talks about Trusted AI and the vital pillars brands need to stick by in order to deploy trustworthy AI
In this interview from the AI Summit New York, Ronen Fischler, head of the data intelligence business unit at Amdocs, discusses exciting advancements in AI and 5G
In this interview from the AI Summit New York, Omdia’s Mark Beccue talks about how brands are implementing AI and offered his thoughts on how the market is evolving
In this interview from the AI Summit New York show floor, Tommy See from Blue Yonder explains to Chuck Martin the major importance AI brings to the supply chain
In this interview from the AI Summit New York show floor, Robert Christiansen and Matt Maccaux from HPE provide expert insight and advice on how brands can effectively upgrade legacy deployments
In this interview from the AI Summit New York show floor, Jean-François Gagné, head of AI product management and strategy at ServiceNow, expertly navigates the current state of the workflow automation market
In this interview from the AI Summit New York show floor, Michael Griffin, chief data scientist at Insight talked high impact AI and the transition to providing actionable insights via AI
In this interview from the AI Summit New York show floor, Ben Schneider, VP of product at Alegion, takes a deep dive into data labeling in the automotive and AR and VR spaces
From the show floor of the AI Summit New York, IBM’s global chief AI Officer Seth Dobrin tells Chuck Martin how he manages the whole company’s AI strategy
At the AI Summit New York, Cassandra Mooshian, senior analyst at Omdia, outlines findings from the recent Omdia Universe report on RPA and intelligent automation
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Josh Builta, AI & IoT research director at Omdia, talk about how AI and IoT complement one another.
In this interview from the DesignCon 2021 show floor, senior Omdia analyst Paul Pickering tells Chuck Martin, editorial director at Informa Tech, that the global chip shortage didn’t forget power semiconductors.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Omdia senior principal analyst Lee Ratliff discuss the rapid growth of the connectivity market.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Lang Lin from Ansys take a look at data security in chip designs.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Karl Bois, senior principal hardware engineer at TE Connectivity, discussed continuing 5G proliferation.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Broadcom director and engineer Cathy Li talk all things high-speed I/O.
In this session from ATxSG, Frederic Salmon, VP Asia Pacific for BICS SA/NV outlines how 5G is a technology enabler for enterprises and how 5G will impact APAC.
In this session from ATxSG, hear from telco experts from the likes of NCS, Omdia, Google and M1 on how telco companies in Asia can become more agile and adaptive to customer needs and take advantage of new digital opportunities.
In this interview, Ben Wodecki sat down with Stephen Raj, partner, global sales for Telco+ at NCS. Stephen outlined how telcos should aim to adapt and evolve in order to keep pace with increasing innovation.
In this interview, Ben Wodecki is joined by Katsuo Ejima, chief evangelist of QKD Business Development Office at Toshiba Digital Solutions and Chune Yang Lum, co-founder and CEO at SpeQtral. The trio talk about how quantum technologies can be the essential cybersecurity tool of the future.
In this interview, Ben Wodecki is joined by Katsuo Ejima, chief evangelist of QKD Business Development Office at Toshiba Digital Solutions and Chune Yang Lum, co-founder and CEO at SpeQtral. The trio talk about how quantum technologies can be the essential cybersecurity tool of the future.
In this session, SpeQtral CEO Chune Yang Lum and Katsuro Ekima from Toshiba's QKD office outline how quantum key distribution technology can be adopted in today’s networks and what the secure communications networks of the future would look like
In this eBook, sponsored by information and communications technology (ICT) provider Huawei, we explore the new intelligent applications that digital connectivity will bring.
In this eBook, sponsored by information and communications technology (ICT) provider Huawei, we explore the current 5G landscape, and the future opportunities and challenges.
At the AI Summit New York, IBM Consulting's Manish Goyal talks about Trusted AI and the vital pillars brands need to stick by in order to deploy trustworthy AI
In this interview from the AI Summit New York, Ronen Fischler, head of the data intelligence business unit at Amdocs, discusses exciting advancements in AI and 5G
In this interview from the AI Summit New York, Omdia’s Mark Beccue talks about how brands are implementing AI and offered his thoughts on how the market is evolving
In this interview from the AI Summit New York show floor, Tommy See from Blue Yonder explains to Chuck Martin the major importance AI brings to the supply chain
In this interview from the AI Summit New York show floor, Robert Christiansen and Matt Maccaux from HPE provide expert insight and advice on how brands can effectively upgrade legacy deployments
In this interview from the AI Summit New York show floor, Jean-François Gagné, head of AI product management and strategy at ServiceNow, expertly navigates the current state of the workflow automation market
In this interview from the AI Summit New York show floor, Michael Griffin, chief data scientist at Insight talked high impact AI and the transition to providing actionable insights via AI
In this interview from the AI Summit New York show floor, Ben Schneider, VP of product at Alegion, takes a deep dive into data labeling in the automotive and AR and VR spaces
From the show floor of the AI Summit New York, IBM’s global chief AI Officer Seth Dobrin tells Chuck Martin how he manages the whole company’s AI strategy
At the AI Summit New York, Cassandra Mooshian, senior analyst at Omdia, outlines findings from the recent Omdia Universe report on RPA and intelligent automation
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Josh Builta, AI & IoT research director at Omdia, talk about how AI and IoT complement one another.
In this interview from the DesignCon 2021 show floor, senior Omdia analyst Paul Pickering tells Chuck Martin, editorial director at Informa Tech, that the global chip shortage didn’t forget power semiconductors.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Omdia senior principal analyst Lee Ratliff discuss the rapid growth of the connectivity market.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Lang Lin from Ansys take a look at data security in chip designs.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Karl Bois, senior principal hardware engineer at TE Connectivity, discussed continuing 5G proliferation.
In this interview from the DesignCon 2021 show floor, Chuck Martin, editorial director at Informa Tech, and Broadcom director and engineer Cathy Li talk all things high-speed I/O.